Oxidative pressurized acid leaching of waste printed circuit boards
1
Aalto University, School of Chemical Engineering
2
Technical University of Kosice, Institute of Recycling Technologies
Publication date: 2017-03-17
Corresponding author
Mari Lundstrom
Aalto University, School of Chemical Engineering, Vuorimiehentie 2, 02150 Espoo, Finland
Aalto University, School of Chemical Engineering, Vuorimiehentie 2, 02150 Espoo, Finland
Physicochem. Probl. Miner. Process. 2017;53(2):781-792
KEYWORDS
TOPICS
ABSTRACT
The amount of waste printed circuit board (WPCB) increases continuously. There is an economic and environmental need to recover valuable metals from WPCBs. In this study, the applicability of oxidative pressurized acid leaching of WPCBs rich in copper and tin was investigated. The effect of leaching parameters such as temperature, partial oxygen pressure and chloride concentration on metal dissolution from WPCBs was studied in sulfuric acid media. It was shown that non-metallic elements present in WPCBs initiated gas formation, namely CO2 and CO, during oxidized pressure acid leach. Decomposition of plastic components already started at 90 °C with 1.5 MPa oxygen overpressure in the presence of 1 g/dm3 chlorides. Gas formation was shown to have a negative impact on the process since copper extraction was reduced to 27% compared to 80-90% extraction achieved from anode slimes used as a reference material. It was suggested that gas formation related to plastic components could have a severe impact on metal yields. The highest dissolution of tin equal to 36% was achieved at room temperature. It was found that higher temperature promoted tin hydrolysis.
REFERENCES (19)
1.
EU DIRECTIVE 2012/19/EU on waste electrical and electronic equipment (WEEE), 2012. The European Parliament and Council of the European Union (4 July 2012).
2.
BIZZO, W.A., FIGUEIREDO, R.A., DE ANDRADE, V.F, 2014. Characterization of printed ciruit boards for metal and energy recovery after milling and mechanical separation. Materials 7, 4555-4566.
3.
CALGARO, C.O., SCHLEMMER, D.F., DA SILVA, M.D.C.R., MAZIERO, E.V., TANABE, E.H., BERTUOL, D.A., 2015. Fast copper extraction from printed circuit boards using supercritial carbon dioxide. Waste Manage. 45, 289-297.
4.
CHEN, M., HUANG, J., OGUNSEITAN, O.A., ZHU, N., WANG, Y, 2015. Comparative study on copper leaching from waste printed circuit boards by typical ionic liquid acids. Waste Manage. 41, 142-147.
5.
CUI, J., ZHANG, L., 2008. Metallurgical recovery of metals from electronic waste: a review. J. Hazard. Mater. 158 (2-3), 228-256.
6.
FORWARD, F.A., VIZSOLYI, A.I., 1966. Tin purification process, United States Patent Office 3293026, Patented December 20, 1966.
7.
HAIG, S., MORRISH, L., MORTON, R., WILKINSON, S., 2012. Overview: Electrical product material composition. WRAP Waste & Resources Action Programme, report IMT002, Axionconsulting.
8.
HSC Sim 8, 2014. Thermochemical and process simulation, Outotec Research Center, www.outotec.com (January 2, 2017).
9.
JHA, M.K., LEE, J-C., KUMARI, A., CHOUBEY, P.K., KUMAR, V., JEONG, J., 2011. Pressure leaching of metals from waste printed circuit boards using sulfuric acid. JOM 63 (8), 29-32.
10.
JÄRVINEN, O., 2000. Outokumpu Process for the Precious Metal Refining from Copper Anode Slime. EPD Congress 2000, Warrendale, TMS-AIME, 511-514.
11.
LAMBERT, F., GAYDARDZHIEV, S., LEONARD, G., LEWIS, G., BAREEL, P-F., 2015. Copper leaching from waste electric cables by biohydrometallurgy. Min. Eng. 76, 38-46.
12.
SHENG, P.P., ETSELL, T.H., 2007. Recovery of gold from computer circuit board scrap using aqua regia. Waste Manage. 25, 380 – 383.
13.
SUN, Z.H.I., XIAO, Y., SIETSEMA, J., AGTERHUIS, H., VISSER, G., YANG, Y., 2015. Selective copper recovery from complex mixtures of end-of-life electronic products with ammonia-based solution. Hydrometallurgy 152, 91-99.
14.
TREADWELL, F.P., 1903. Analytical Chemistry, Volume I, Qualitative analysis, translated and revised by William T. H., John Wiley & Sons, New York, p.250.
15.
WANG, R., XU, Z., 2014. Recycling of non-metallic fractions from waste electrical and electronic equipment (WEEE): A review. Waste Manage. 34, 1455-1469.
16.
XIU, F-R., QI, Y., ZHANG, F-S., 2015. Leaching of Au, Ag, and Pd from waste printed circuit boards of mobile phone by iodide lixiviant after supercritical water pre-treatment. Waste Manage. 41, 134-141.
17.
YAMANE, L.H., DE MORAES, V.T., ESPINOSA, R.D.C., TENORIO, J.A.S., 2011. Recycling of WEEE: Characterization of spent printed circuit boards from mobile phones and computers. Waste Manage. 31 (12), 2553-2558.
18.
YAZICI, E.Y., DEVECI, H., 2014. Ferric sulphate leaching of metals from waste printed circuit boards. Int. J. Miner. Proc. 133, 39-45.
19.
YAZICI, E.Y., DEVECI, H., 2015. Cupric chloride leaching (HCl-CuCl2-NaCl) of metals from waste printed circuit boards (WPCBs). Int. J. Miner. Proc. 134, 89-96.
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